MediaTek Dimensity 8300 brings Armv9 CPU, 60% faster GPU and generative AI capabilities

MediaTek has announced its latest 8000 series chipset with the Dimensity 8300. The new SoC is based on TSMC’s second-generation 4nm process and is the direct successor to last year’s Dimensity 8200, offering performance improvements to all levels.

MediaTek Dimensions 8300

The Dimensity 8300 features 4 Arm Cortex-A715 performance cores clocked at up to 3.35 GHz as well as 4 Arm Cortex-A510 efficiency units at clock speeds up to 2.2 GHz. The eight cores are based on the Armv9 CPU architecture and MediaTek claims up to 20% faster CPU performance and maximum power efficiency gains of 30% compared to the outgoing Dimensity 8200.

Dimensions 8300 Dimensions 8200 Dimensions 8100
Node 4nm 4nm 5nm
Main processor 1x Cortex-A715 at 3.35 GHz 1x Cortex-A78 at 3.1 GHz
Big processor 3x Cortex-A715 @ 3.0 GHz 4x Cortex-A78 @ 3.0 GHz 4x Cortex-A78 at 2.85 GHz
CPU bit 4x Cortex-A510 at 2.2 GHz 4x Cortex-A55 @ 2.0 GHz 4x Cortex-A55 @ 2.0 GHz
RAM LPDDR5X (up to 8,533 Mbps) LPDDR5 (up to 6,400 Mbps) LPDDR5 (up to 6,400 Mbps)
Storage UFS 4.0 with MCQ UFS3.1 UFS3.1
GPU Mali-G615 (60% faster than 8200) Mali-G610 MC6 Mali-G610 MC6
Display FHD+ at 180Hz, WQHD+ at 120Hz FHD+ at 168Hz, WQHD+ at 120Hz FHD+ at 180Hz, WQHD+ at 120Hz
Camera (photos) 320MP 320MP 200MP
Video camera) 4K at 60fps (HDR10+) 4K at 60fps (HDR10+) 4K at 60fps (HDR10+)
5G 5.17 Gbps downlink 4.7 Gbps downlink 4.7 Gbps downlink
Wireless Wi-Fi 6E (2×2) Wi-Fi 6E (2×2) Wi-Fi 6E (2×2)
Bluetooth 5.4 5.3 5.3

The new chip also features an Arm Mali-G615 MC6 GPU that brings up to 60% performance gains and 55% improved power efficiency at peak speeds compared to its predecessor. MediaTek also claims up to 17% faster cold launch of apps and up to 47% faster launch of apps in sleep mode with the new chip. The new chip also supports quad-channel LPDDR5X RAM at speeds of 8,533 Mbps and UFS 4.0 storage with multi-circle queue (MCQ) support.

The 780 APU inside the Dimensity 8300 makes it the first chip in its class to support generative AI with stable streaming and LLM support with up to 10 billion parameters. The Imagiq 980 ISP supports up to 320 MP camera sensors and 4K video recording at 60 fps.

Distribution of dimension 8300

Distribution of dimension 8300

The Dimensity 8300 has an integrated 5G modem supporting dual-mode 5G and downlink of up to 5.17 Gbps on networks below 6 GHz. The chip is also equipped with Wi-Fi 6E and Bluetooth 5.4 connectivity.

Xiaomi has already confirmed that its Redmi Note 70E will launch the Dimensity 8300 later this month.


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